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THE FILM IS THE "SKELETON, BLOOD VESSELS, SKIN AND BRAIN" OF THE CHIP, AND ALL OF THESE ELEMENTS ARE INDISPENSABLE.

2026-08-12

Why does the semiconductor need thin films?

A single chip is, in essence, a three-dimensional structure formed by the precise stacking of hundreds of thin-film layers.

Each layer serves a specific function:

Thin Film Type	Function	Typical Materials
Conductive Layer	Conduct electric current and connect devices	Al, Cu, W, TiN
Insulation Layer	Isolate circuits and prevent electric leakage	SiO₂, SiN, Low-k
Barrier Layer	Prevent diffusion and improve reliability	TaN, TiN, W
Gate Material	Control device switching	Poly-Si, Metal Gate
Passivation Layer	Protect surface and enhance stability	SiN, SiON
Dielectric Layer	Store electric charge to realize functions

Semiconductor thin film technology

PVD: Atoms are ejected from the target onto the wafer via physical means;
CVD: Thin films are formed through chemical reactions of gases on the wafer surface.

How is the film formed?

1. Material Source: Solid target, gaseous reactant or chemical precursor;
2. Transport: Via plasma, vacuum, carrier gas or diffusion;
3. Surface Reaction: Physical adsorption or chemical reaction occurs on the wafer surface;
4. Nucleation & Growth: Atomic aggregation for nucleation, island growth, continuous film formation and densification;
5. Film Formation: Form a thin film with increasing thickness, dense structure and stable microstructure.

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